Tuesday, March 17, 2009
Antiseptic single wall carbon nanotube bandages
Single wall carbon nanotubes (SWCNTs) are coated with polyvinylpyrrolidone-iodine (povidone-iodine or PVPI) in water. This solution of SWCNT and PVPI is deposited as a composite film, composed of individual and bundled SWCNTs with a PVPI coating. This material acts as a conductive nanotextured bandage with high flexibility and self contained slow-release antiseptic iodine. Antibacterial properties were tested on Escherichia coli, showing high efficacy over 48 h. Four-probe resistance tests showed a sheet resistance of approximately 10 kΩ/□.
This material show promise for wound healing applications where regeneration of nervous tissue connections is desired, as it will act to prevent infection, allow oxygen to the wound site through micron sized pores, provide a nanotextured substrate material for nervous and tissue growth, and stimulate reconnection of nerve cells by electrical pulsing.
(T.J. Simmons, S.-H. Lee, T.-J. Park, D.P. Hashim, P.M. Ajayan, and R.J. Linhardt, Carbon 2009, article in press,
doi:10.1016/j.carbon.2009.02.005)
This material show promise for wound healing applications where regeneration of nervous tissue connections is desired, as it will act to prevent infection, allow oxygen to the wound site through micron sized pores, provide a nanotextured substrate material for nervous and tissue growth, and stimulate reconnection of nerve cells by electrical pulsing.
(T.J. Simmons, S.-H. Lee, T.-J. Park, D.P. Hashim, P.M. Ajayan, and R.J. Linhardt, Carbon 2009, article in press,
doi:10.1016/j.carbon.2009.02.005)
Formation and assembly of carbon nanotube bumps for interconnection applications
A simple assembly process of carbon nanotube (CNT) bumps could be used for flip chip interconnects was proposed and investigated. Firstly, high density aligned CNT bumps were grown on both top and bottom substrates. By employing typical flip chip bonding technique, the CNT bumps on the flipped top substrate were aligned with those on the bottom substrate. Applying a downward force on the die, the CNT bumps on the top substrate were pressed and inserted into the CNT bumps on the bottom substrate.
After CNT insertion, the CNTs were held together with van der Waals force and the CNT interconnection bumps were formed. The electrical conductivity of the CNT interconnection bumps was measured and compared to conductive silver adhesive. The conductivity of CNT interconnection bump was found to be of many magnitudes higher than that of silver adhesive. It was demonstrated that the CNT bumps have a much superior electrical properties over the typical metallic bumps.
(K. P. Yung, J. Wei, and B. K. Tay, Diamond and Related Materials 2009, article in press,
doi: 10.1016/j.diamond.2009.02.022)
After CNT insertion, the CNTs were held together with van der Waals force and the CNT interconnection bumps were formed. The electrical conductivity of the CNT interconnection bumps was measured and compared to conductive silver adhesive. The conductivity of CNT interconnection bump was found to be of many magnitudes higher than that of silver adhesive. It was demonstrated that the CNT bumps have a much superior electrical properties over the typical metallic bumps.
(K. P. Yung, J. Wei, and B. K. Tay, Diamond and Related Materials 2009, article in press,
doi: 10.1016/j.diamond.2009.02.022)
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